acers meeting highlights
Overcoming ceramic challenges at the 48th ICACC in Daytona Beach
The 48th International Conference and Expo on Advanced Ceramics and Composites (ICACC 2024) welcomed more than 800 people, including nearly 200 students, from 28 countries to Daytona Beach, Fla., from Jan. 28–Feb. 2, 2024. This year’s conference included 19 symposia; five focused sessions; and a special focused session on diversity, entrepreneurship, and commercialization. Read all highlights from this meeting.
Overcoming ceramic challenges at the 48th ICACC in Daytona Beach
The 48th International Conference and Expo on Advanced Ceramics and Composites (ICACC 2024) welcomed more than 800 people, including nearly 200 students, from 28 countries to Daytona Beach, Fla., from Jan. 28–Feb. 2, 2024. This year’s conference included 19 symposia; five focused sessions; and a special focused session on diversity, entrepreneurship, and commercialization. Read all highlights from this meeting.
EMA 2024 debuts in Denver
Traditionally held in Orlando, Fla., the Electronic Materials and Applications Conference took place this year in Denver, Colo., from Feb. 13–16, 2024. Attendance was up from last year’s conference, with more than 330 attendees coming from 22 countries. Electronics Division organizers were Mina Yoon of Oak Ridge National Laboratory and Matjaz Spreitzer of Josef Stefan Institute in Slovenia. Basic Science Division organizers were Fei Peng of Clemson University and Klaus Van Benthem of the University of California, Davis. Read all highlights from this meeting.
ADVERTISEMENT
EMA 2024 debuts in Denver
Traditionally held in Orlando, Fla., the Electronic Materials and Applications Conference took place this year in Denver, Colo., from Feb. 13–16, 2024. Attendance was up from last year’s conference, with more than 330 attendees coming from 22 countries. Electronics Division organizers were Mina Yoon of Oak Ridge National Laboratory and Matjaz Spreitzer of Josef Stefan Institute in Slovenia. Basic Science Division organizers were Fei Peng of Clemson University and Klaus Van Benthem of the University of California, Davis. Read all highlights from this meeting.